Vietnam has demonstrated sincerity in trade negotiations, helping the United States achieve positive outcomes with its partners, said Minister of Industry and Trade Nguyen Hong Dien.
On the afternoon of November 14 (local time), at the Vietnamese Embassy in Washington D.C., Minister Nguyen Hong Dien met with U.S. Under Secretary of State for Economic Growth, Energy, and the Environment, Jacob Helberg.
During the meeting, Minister Dien reaffirmed Vietnam’s consistent policy of expanding cooperation with the U.S. in high-tech sectors - a strategic move aligned with the Comprehensive Strategic Partnership framework between the two countries.
Minister Nguyen Hong Dien meets with U.S. Under Secretary of State Jacob Helberg.
Vietnam is targeting science, technology, and innovation-driven growth, aiming for an annual growth rate above 10% in the next decade. Within that strategy, cooperation with the U.S. in artificial intelligence (AI), advanced technology, and tech ecosystem development is considered both appropriate and necessary.
The Minister emphasized that Vietnam had shown clear goodwill during trade negotiations, facilitating favorable outcomes for the U.S. and its partners. He expressed Vietnam’s hope for a rational and flexible approach from the U.S., appropriate to the nature of the strategic partnership.
Minister Dien proposed that the U.S. remove Vietnam from its D1 and D3 control lists, which restrict high-tech product exports, and formally recognize Vietnam as a market economy. These moves, he noted, would lay a stronger foundation for future cooperation.
Under Secretary Helberg acknowledged Vietnam’s proactive stance, particularly its initiative in AI cooperation. He reiterated the U.S. commitment to collaborating with Vietnam across areas such as security, energy, logistics, supply chains, and manufacturing.
He recalled previous discussions with Minister Dien in Malaysia and emphasized the importance of building a leading-edge tech ecosystem and mechanisms to protect core industries, particularly semiconductors and AI.
Helberg described Vietnam as a strategic manufacturing hub with great potential to contribute to U.S. high-tech development.
He welcomed Vietnam’s proposals and confirmed that he would report them to senior leaders, including U.S. President Donald Trump.
Helberg also highlighted two parallel approaches: advancing a reciprocal trade agreement and expanding strategic cooperation in economic security, supply chains, and technology. He proposed developing common principles as the foundation for sector-specific MOUs and pilot projects.
Progress made in fifth round of reciprocal trade agreement negotiations
Minister Dien reaffirms Vietnam’s commitment to expanding high-tech cooperation with the U.S.
Under Secretary Helberg praises Vietnam’s initiative in AI collaboration.
The fifth round of direct talks on the Vietnam–U.S. Reciprocal Trade Agreement was held from November 12 to 14 in Washington D.C., led by Minister Nguyen Hong Dien as Head of Vietnam’s Government Negotiating Delegation.
Over three days, negotiators from both countries made significant progress in multiple areas, including services, digital trade, agriculture, technical barriers to trade (TBT), and sanitary and phytosanitary measures (SPS). Differences on remaining issues were narrowed.
At the closing meeting, both the U.S. Trade Representative (USTR) and Vietnam’s negotiation team described the talks as highly constructive, paving the way for a timely conclusion of the agreement.
The U.S. appreciated Vietnam’s goodwill, creative approach, and especially the productive pre-negotiation dialogue between Minister Nguyen Hong Dien and USTR chief negotiator Jamieson Greer.
Based on Vietnam’s proposals, the U.S. gave preliminary positive responses and said it would consider them within the broader context of the overall negotiation outcomes.
Both sides agreed on follow-up actions and planned to hold several online meetings in the coming days to resolve outstanding issues and prepare for the next virtual ministerial-level negotiation between Jamieson Greer and Minister Nguyen Hong Dien, expected later this November.
Beyond official negotiations, Minister Dien also met with U.S. Deputy Secretary of State, members of Congress including the Chair of the House Ways and Means Committee, and leaders of major tech and semiconductor corporations and industry associations to promote bilateral economic, investment, and trade cooperation.